Hurukuro yeHuain Capacitive Conference System Dual Diaphragm Pickup HY-621D

Kushandiswa kwetekinoroji yedhijitari yeDSP audio processing chip conference kuti pave nekutumira uye kugadzirisa masaini edhijitari;

ine basa rekudzivirira mvura, kudzivirira kusangana kwekushandiswa kwetii pakushandisa michina nguva dzose;

Dhizaini yechitarisiko

- Hwaro hwacho hwakagadzirwa nechinhu chimwe chete chinogadzirwa ne zinc alloy, pamusoro pacho hapana misono, hapana maburi ekukurura;

- Kutora zinc-aluminiyamu alloy maikorofoni danda, yakavakirwa mukati memusoro wekutora we diaphragm une hunyanzvi hwepamusoro, kona inochinjika inochinjika;

Basa remvura

- Kudzivirira kusangana kwetii kunokanganisa kushandiswa kwemidziyo nguva dzose;

Nheyo yemakrofoni

- Yakashongedzerwa negomba rakaoma re32500 dhayamita 0.4mm high-density sound, uye density yacho iri pasi pemvura, kuitira kuvandudza signal-to-noise ratio panguva imwe chete inogonawo kudzivirira kupinda kwemvura zvinobudirira;

Tekinoroji yekuparadzanisa isina kusimba

- Yakagadzirwa netekinoroji yepamusoro yekudzikisa magetsi, inogona kudzivirira magetsi asingachinji kunyangwe munzvimbo dzakaoma nenzvimbo dzakaoma;

Tekinoroji yakasimba yekudzivirira kukanganiswa

- Kushandisa tekinoroji yedhijitari yakasimba yekudzivirira kukanganiswa kwezvinhu kuitira kuti michina iri panzvimbo iyi isakanganiswa nefoni, Bluetooth, redhiyo, WiFi nezvimwe zviratidzo;